(0,50mm) .0197" qth series polarized qth?030?01?l?d?a?rt1 qth?060?07?f?d?a qth?090?01?c?d?a standard stack heights from 5mm to 25mm integral metal plane for power or ground www.samtec.com qth pins per row no. of pairs plating option ?030, ?060, ?090, ?120 (60 total pins per bank = ?d) ?020, ?040, ?060, ?080 (20 pairs per bank = ?d?dp) ?f = gold flash on signal pins and ground plane, matte tin on tails ?l = 10" (0,25m) gold on signal pins and ground plane, matte tin on tails ?c* = electro-polished selective 50" (1,27m) min au over 150" (3,81m) ni on signal pins in contact area, 10" (0,25m) min au over 50" (1,27m) ni on ground plane in contact area, matte tin over 50" (1,27m) min ni on all solder tails ?d = single-ended ?d?dp = differential pair (?01 only) lead style type a other option ?k = (7,00mm) .275" dia polyimide ? lm pick & place pad (n/a with -05 & -07 lead style) ?tr = tape & reel (?090 positions maximum) ?rt1 = retention option (?01 lead style only & ?090 positions maximum) ?l = latching option (?01 lead style only) (n/a on ?090 & ?120 or ?rt1 option) specify lead style from chart qth lead style a height with qsh* ?01 (4,27) .168 (5,00) .197 ?02 (7,26) .286 (8,00) .315 ?03 (10,27) .404 (11,00) .433 ?04 (15,25) .600 (16,00) .630 ?05 (18,26) .718 (19,00) .748 ?07 (24,24) .954 (25,00) .984 *processing conditions will affect mated height. board mates: qsh cable mates: hfhm2, hqcd, hqdp (see application speci c note) for complete speci cations and recommended pcb layouts see www.samtec.com?qth insulator material: liquid crystal polymer terminal material: phosphor bronze plating: au or sn over 50? (1,27?) ni current rating: contact: 1.0a @ 30? temperature rise ground plane: 7.8a @ 30? temperature rise operating temp range: -55? to +125? voltage rating: 125 vac (5mm stack height) max cycles: 100 unmating force (-rt1 option): -rt1 option increases unmating force up to 50% rohs compliant: ye s processing: lead?free solderable: ye s smt lead coplanarity: (0,10mm) .004" max (030-060) (0,15mm) .006" max (090-120) board stacking: for applications requiring more than two connectors per board or 4 banks or more, contact ipg@samtec.com board spacing standoffs. see so series. also available ?03 thru ?07 ?01 & ?02 ?rt1 ?l application specific option ? 14mm, 15mm, 22mm and 30mm stack height (caution: some automatic placement/inspection machines may have component height restrictions. please consult machinery speci cations.) ? 30? (0,76?) gold (specify -h plating for data rate cable mating applications.) ? edge mount & guide posts ? 150 positions per row call samtec. f-211-1 *note: ? plating passes 10 year mfg testing note: some lengths, styles and options are non-standard, non-returnable. specifications hypertransport ? xaui pci express ? sata infiniband download app notes at www.samtec.com/appnote contact sig @ samtec.com for questions on protocols protocols supported high speed ground plane header f i n a l i n c h . c o m ? 5mm stack height type rated @ 3db insertion loss single-ended signaling ?d 9 ghz / 18 gbps differential pair signaling ?d 8 ghz / 16 gbps differential pair signaling ?dp 9.5 ghz / 19 gbps performance data for other stack heights and complete test data available at www.samtec.com?qth or contact sig@samtec.com ? extended life product 10 year mixed flowing gas with 50" gold tm call samtec for maximum cycles mated with qsh ?retention pin option (20,00) .7875 ?p = (no. of pairs per row/20) x (20,00) .7875 ? = (no. of pins per row/30) x (20,00) .7875 (0,20) .008 (0,50) .0197 01 02 (7,11) .280 (0,76) .030 (3,30) .130 (1,57) .062 (1,57) .062 dia (0,64) .025 (0,89) .035 dia a a
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